Ceramic Packages

Kyocera has supplied ceramic packages since 1964 which are used for a wide range of semiconductor and electronic devices such as image sensors, accelerometers, gyroscopes, microprocessors, light emitting diodes (LEDs), fiber-optic communication modules, radio-frequency power transistors, Monolithic Microwave Integrated Circuits (MMICs), crystal devices and surface-acoustic wave (SAW) devices.

Product Line-Up

*For more detailed info, please visit the Kyocera Global site.

Glow Plugs

Surface Mount Ceramic Packages for Electronic Devices

Glow Plugs

Ceramic Packages for MEMS Sensors

Glow Plugs

Ceramic Packages and Optical Filters for Image Sensors

Glow Plugs

Ceramic Packages for Light Emitting Diodes (LEDs)

Glow Plugs

Ceramic Packages for Automotive Electronics

Glow Plugs

Ceramic Packages for Power Electronics

Glow Plugs

Ceramic Packages for Large Scale Integration (LSI)

Glow Plugs

Components for Fibre-Optic Communication Modules

Glow Plugs

Components for Wireless Communication Devices

Glow Plugs

Components for Fibre-Optic Connectors

Glow Plugs

LTCC Packages for RF Modules

Glow Plugs

Ceramic Substrates for Probe Cards

Glow Plugs

Standard Packages and Lids for Device Evaluation

Glow Plugs

Glass Hermetic Feedthroughs

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