Kyocera has been supplying ceramic packages since 1964. Our ceramic packages are used for a wide range of semiconductor and electronic devices such as image sensors, accelerometers, gyroscopes, microprocessors, light emitting diodes (LEDs), fiber-optic communication modules, radio-frequency power transistors, monolithic microwave integrated circuits (MMICs), crystal devices, and surface-acoustic wave (SAW) devices. Housed in our ceramic packages, these types of devices are used for mobile phones, wireless and fiber-optic communication infrastructure equipment, automobiles, computers, medical devices, industrial manufacturing equipment, and scientific research equipment.
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Components for RF & Wireless Communication Device
Standard Packages & Lid for Device Evaluation
LTCC Packages for RF Modules
Ceramic Packages for Light Emitted Diodes (LED)
Ceramic Packages and Optical filters for Image Sensors
Surface Mount Ceramic Packages for Electronic Devices
Ceramic Packages for MEMS Sensors
Compact Ceramic RFID Tags (UHF Band & HF Band)
Components for LIDAR and 3D Sensing
Ceramic Packages for Power Electronics
Ceramic Packages for Automotive Electronics
Ceramic Packages for Large Scale Integration (LSI) Devices
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